| PART |
Description |
Maker |
| GBU800 GBU808 |
8.0Amps Glass Passivated Single Phase Silico n Bridge
|
First Components International
|
| PUMA67S16000M-025 PUMA2S16000I-45 PUMA67S16000I-45 |
150NS, PLCC, COM TEMP(FLASH)
15NS, 44 PLCC, COM TEMP(EPLD)
30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA)
20NS, 44 PLCC, COM TEMP(EPLD)
150NS, TSOP, IND TEMP(FLASH)
20NS, 44 TQFP, IND TEMP(EPLD)
120NS, SOIC, IND TEMP(EEPROM)
70NS, TSOP, IND TEMP(EEPROM)
15NS, 68 PLCC, IND TEMP(EPLD)
25NS, 68 PLCC, IND TEMP(EPLD)
30MHZ, 32 TQFP, COM TEMP(FPGA)
120NS, PDIP, IND TEMP(EEPROM)
32 MCROCELL CPLD 1.8V ISP TQFP IND GREEN(EPLD)
x32 SRAM Module X32号的SRAM模块
90NS, TSOP, IND TEMP(EEPROM) X32号的SRAM模块
120NS, PLCC, IND TEMP(EEPROM)
|
DB Lectro, Inc.
TE Connectivity, Ltd.
|
| PUMA68S4000/I-45 PUMA68S4000/M-45 PUMA68S4000/AI-3 |
24MHZ, TQFP, IND TEMP, GREEN(MCU 5X)
33MHZ, PLCC, COM TEMP(MCU 5X)
8051 32K FLASH 4 TO 5.5V,PDIP,GREEN(MCU 5X)
24MHZ, PDIP, IND TEMP(MCU 5X)
x32 SRAM Module
20MHZ, TSSOP, IND TEMP, 2.4-5.5V(MCU 5X)
24MHZ, TQFP, COM TEMP(MCU 5X) X32号的SRAM模块
|
L-com, Inc.
|
| AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT- |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, PLCC, COM TEMP(EPLD)
20NS, SOIC, IND TEMP(EPLD)
25NS, SOIC, COM TEMP(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM TEMP(FPGA)
10MHZ, 20 PLCC, IND TEMP(FPGA)
10MHZ, 32 TQFP, COM TEMP(FPGA)
10MHZ, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE)
65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
128K CONFIG MEM, 20 PLCC, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
ADVANCED MICRO DEVICES INC
|
| AM3064-70/BZC AM3064-50GI175 AM3064-50JC068 AM3090 |
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
DIE SALE, 2.7V, 7 MIL(BIOS FLASH)
10MS, 8 SAP, IND, ROHS-B, 2.7V(BIOS FLASH)
8-SOIC,AUTO TEMP,2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, 2.7V(SERIAL EE)
10MS, 8 PDIP, EXT TEMP, GREEN,2.7V(SERIAL EE)
10MS, 8 TSSOP, INT TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 PDIP, INT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN,2.7V(SERIAL EE)
8 ULTRA THIN,MINI MAP,PB/HALO FREE,IND T(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
Field Programmable Gate Array (FPGA) 现场可编程门阵列（FPGA
10MS, 8 SOIC, INT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 PDIP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
|
Stackpole Electronics, Inc.
Ecliptek, Corp.
Analog Devices, Inc.
Glenair, Inc.
|
| T342-SERIES X342-SERIES T322-SERIES X322-SERIES T3 |
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7V(SERIAL EE)
BGA,GREEN,IND TEMP(ARM)
NGD: SMART CARD, MODULE(SMARTCARDS)
20NS, TQFP, IND TEMP(EPLD) 外围芯片
Peripheral IC 外围芯片
|
Marktech Optoelectronics
|
| AM3090-70MP175 AM3090-70MP84 AM3020-50CP175 AM3020 |
8-SOIC (NARROW BODY) IND TEMP, GREEN(BIOS FLASH)
8-MLF (NARROW BODY) IND TEMP GREEN(BIOS FLASH)
10MS, 8 EIAJ SOIC, AUTO TEMP, 2.7V(SERIAL EE)
10MS, DIE, 1.8V, 11 MILS(SERIAL EE)
10MS, DBGA2, INT TEMP, GREEN, 1.8(SERIAL EE)
10MS, 8 MAP, IND TEMP, GREEN, 1.8V(SERIAL EE)
ASIC 专用集成电路
|
Linear Technology, Corp.
|
| PUMA2US2500I-2512 PUMA2US2500I-2510 PUMA2US2500I-2 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 MINI-MAP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 LAP, IND TEMP, GREEN, 2.7V(SERIAL EE)
SRAM/EPROM 静态存储器/存储
10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE) 静态存储器/存储
|
TDK, Corp.
TE Connectivity, Ltd.
|
| X9511_07 X9511 X9511WP X9511WPI X9511WPIZ X9511WPZ |
The Intersil X9511 is a push button controlled potenti ometer that is ideal for push button controlled resis tance trimming
Single Push Button Controlled Potentiometer (
|
INTERSIL[Intersil Corporation]
|
| PUMA67S4000M-020 PUMA67S4000M-35 PUMA2S4000M-020 P |
SRAM|128KX32|CMOS|LDCC|68PIN|CERAMIC
2NS, 352 BGA, COM TEMP(FPGA)
SRAM|128KX32|CMOS|PGA|66PIN|CERAMIC
10 MHZ, 3.3V, 44 PLCC, IND TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA) 静态存储器| 128KX32 |的CMOS |美巡赛| 66PIN |陶瓷
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQMA68
|
NIC Components, Corp.
|
| HD-6409 HD6409 HD3-6409-9 HD1-6409-9 HD9P6409-9 FN |
Unijunction Transistor; Transistor Polarity:N Channel; Power Dissipation:600mW; Operating Temp. Max:175 C; Operating Temp. Min:-65 C
CMOS Manchester Encoder-Decoder(CMOS Manchester编码译码
From old datasheet system
|
Harris Corporation
INTERSIL[Intersil Corporation]
|
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